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First International Indo-Swiss Technical Symposium on Bonding and Adhesion
Posted Date: 16 Nov 2007 Resource Type: Articles/Knowledge Sharing Category: General
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Posted By: valenteena Member Level: Gold
Rating:  Points: 4
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First International Indo-Swiss Technical Symposium on Bonding and Adhesion
Organised by Department of Rubber and Plastics Technology
Madras Institute of Technology, Anna University
ISB 2008
For many years bonding, sealing and casting have proven to be reliable methods in various branches of industry. Adhesives and sealants are used in many applications such as in mechanical engineering, in automobile design, in the rail industry, in shipbuilding, in the wood industry, in the construction industry, medicine etc.. Bonding technology offers optimal stress distribution in the joint, acceptable long term performance, prevents corrosion, provides reliable, insulating joints, improves safety and comfort etc. The rapidly changing techniques lead continuously to new requirements regarding quality, process, performance and ecology. The 1st International Symposium Indo Swiss Bonding 2008 is designed to cope with these demands. Competent experts and experienced end users from Europe and overseas will present fundamentals, new products and applications. An exhibition and poster session accompany and complement the programme. The Conference venue is located at the Madras Institute of Technology campus of Anna University, Chennai, Tamilnadu, India or any Five Star Hotel in Chennai. This conference is technically Co-Sponsored by Henkel Adhesive Technologies India Pvt Ltd.
Goal of the symposium:
The program is intentionally compiled for the appli?cation technician in bonding technology. This symposium is suited for all those who want to become or are already familiar with bonding technology, as well as for masters, craftsmen, technicians, engineers, designers and scientists from industry and research.
Address for Correspondence
Dr.B.Kothandaraman,
Convener, ISB-2008
Department of Rubber and Plastics Technology,
Madras Institute of Technology, Anna University,
Chrompet, Chennai-600044
INDIA
email : bkraman@mitindia.edu
indoswissbonding08@gmail.com
Phone: 91-44-22516330
Fax: 91-44-22232403
Mobile:9444686881
For more details visit: http://www.annauniv.edu/indo/contact.html
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